電磁兼容原理與設計(基礎知識)
Digital Signal Integrity-Modeling and Simulation with Interconnects and Package
EMC basic
EMC的民用
EMC技術(shù)介紹
EMC技術(shù)介紹
EMC設計技術(shù)
EMI 濾波器設計方法
ESD問答
High-speed Digital Design - Johnson & Graham
High-Speed Digital System Design
PCB上信號線產(chǎn)生的電磁頻譜
板級EMC設計
避免混合訊號系統(tǒng)的設計陷阱
標準化與認證
單片機系統(tǒng)常用軟件抗干擾措施
地線干擾與抑制
電磁干擾濾波電容器使用方法
電磁兼容標準匯編(基礎、通用類卷)
電磁兼容測試
電磁兼容技術(shù)
電磁兼容設計工程手冊
電氣設備內(nèi)部干擾的抑制
高頻干擾的防治
基本名詞術(shù)語
基礎
計算機電磁兼容
開關電源的電磁兼容設計
開關電源的尖峰干擾及其抑制
開關電源的抗干擾問題
讓我們一起認識手機輻射
輸入濾波器的設計

雷擊浪涌發(fā)生器操作手冊
EMC的基礎與實踐
EMC實驗設備
電磁兼容標準匯編(電工、電子類卷)
電磁兼容技術(shù)及電磁兼容實驗室介紹
電磁兼容試驗的注意事項:
電磁兼容試驗室建造方案
電磁兼容試驗室平面布置示意圖-1
PCB Designer's SI Guide
BGA檢測技術(shù)與質(zhì)量控制
BGA器件及其焊點的質(zhì)量控制
Layout_glossary
PCB化學鍍銅工藝流程解讀(二)
PCB化學鍍銅工藝流程解讀(一)
PCB基板材料選擇
PCB通孔電鍍技術(shù)
SMT工作流程圖
smt過程缺陷樣觀和對策
SMT十步驟(電子檔)
波峰焊
內(nèi)埋電阻
去藕電容在PCB板設計中的應用
特性阻抗之詮釋與測試
特性阻抗資訊
無鉛銲錫物料與組裝之研究
印刷電路板排版設計
Abatement of Static Electricity
An EMC Directive for the Next Century
Australian EMC Regulation and Routes to Compliance
Building a Bridge Between Product Safety and EMC
Commercial Practices Standard Set to Replace MIL-STD 1686
Developments in Electrical Safety Testing
Electrical Safety Testing
Electromagnetic Compatibility
EMC & EMI of computer
emc amplifiers
EMC annata select
emc antennas
emc chamber note
EMC design
EMC Shielding
emc test of household
EMI Gasket
EMI Shielding Gasket
emidamage
grounding
Minimizing EMI from Heat Sinks
Mitigating EMI in High-Speed Digital Transmission Networks
PCB design & EMI
Performing Safety
Product Safety Standards
Product Safety
Terminology for electromagnetic compatibility
USB Interfaces and EMC
What to Look for in an EMC Antenna
EMC Problems with Mobile Radio
EMC test and design
EMI detect
EMI fillite
EMI Requirements in Japan
EMI solution
Evaluating the Nonmagnetic Shields
computer ESD solution
From Electrostatics to ESD
What It Means to ESD
Electronic Design
Electronic System Design
EMC Technology
High SpeedBoard Design

CD1'目錄

//softwarefmea
//using_failure_mode_and_effects_analysis_in_healthcare
//software reliability
//Reliability Prediction of Substitute Parts Based on Component
Temperature Rating and Limited Accelerated Test Data
//Reliability Review of North American Gas/Electric System
Interdependency
//Semiconductor Device Reliability Failure Models
//accelerated testing
//Avoiding Vibration in Odd-Shaped
Printed-Circuit Boards
//Better Accelerated Tests
//HALT AND HASS ON THE VOICEMEMO
//Combining Moments of Inertia
//Confidence_interval_of_proportions
//Functional Requirements
//Designing Electronics for High Vibration and Shock
//SUMMARY OF HALT AND HASS RESULTS AT AN ACCELERATED RELIABILITY TEST CENTER
//Highly Accelerated Stressing of Products With Very Low Failure Rates
//HASS DEVELOPMENT METHODOLOGY HOW TO DEVELOP A SCREEN,WHEN TO CHANGE A SCREEN, AND WHEN TO RE-PROVE A SCREEN
//honeywell reliability
//How to Justify Machinery Improvements
//IBM consulting-Becoming A Process Based Organization
//IBM演示技巧教程
//MTBF Report_13 October 04
//MTBF_Paper
//ACCELERATED RELIABILITY TEST TECHNIQUES USED TO FIND DEFECTS WITHIN PRINTED CIRCUIT BOARDS
//Potential Failure Mode and Effects Analysis
//WHY HALT CANNOT PRODUCE A MEANINGFUL MTBF NUMBER AND WHY THIS SHOULD NOT BE A CONCERN
//How to Use Visual Effects to Support Your PresentationA PowerPoint Training
//precautionsic for Use of High-Voltage Monolithic ICs
//PRE-HALT ANALYSIS IS ESSENTIAL FOR A SUCCESSFUL HALT
//Preventing Vibration Damage in Electronic Assemblies
//Reliability and Availability
//An Extended Reliability Growth Model For Managing And Assessing Corrective Actions
//Reliability Monitor Report
//reliability tools and integration in the manufacting phase
//SEMICONDUCTOR DEVICE RELIABILITY
//An introdution to Reliability_and_availability
//Reliability_Mathematics
//reliability-pricing-model-overview
//rr_ed_fault_risk_reduction
//software_reliability_measurement or Life Cycle Core Knowledge Requirements for Software Reliability Measurement
//Taking Shake Out of Circuit Boards
//THERMAL AND VIBRATION ISOLATION TECHNIQUES FOR HARD DRIVES AND PCI CARDS
//Reliability, Availability, and Operability
//PROBABILISTIC ENGINEERING DESIGN
//Where Is My Data For Making Reliability Improvements
//可靠性技術(shù)的應用與發(fā)展
//蒙特卡羅法在零件可靠性設計中的應用
//Failure Mode and Effects Analysis (FMEA) A Guide for Continuous Improvement for the Semiconductor Equipment Industry
//Automatic FMEA
//Representation of Functional Relations among Parts and Its Application to Product Failure Reasoning
//Design FMEA
//FAILURE MODE AND EFFECTS ANALYSIS (FMEA)
//FPU Failure Mode Effects and Criticallity Analysis
//FAILURE MODE AND EFFECTS ANALYSIS IN MANUFACTURING AND ASSEMBLY PROCESSES
//FAILURE MODE IDENTIFICATION THROUGH CLUSTERING ANALYSIS
//fmea di prodotto
//FMEA TOOLS2
//FMEA opdracht tuinsproeier
//FMEA_Form
//Failure Mode and Effect Analysis (FMEA) Packet
//FLIGHT ASSURANCE PROCEDURE
//fmea_presentation
//Complying with the FMEA Requirements of the New
Patient Safety Standards
//ANALISI DEI MODI E DEGLI EFFETTI DELLE AVARIE
//Risk –Informed Regulation of Marine Systems Using FMEA
//Failure Mode and Effects Analysis
//FAILURE MODES AND EFFECTS ANALYSIS (FMEA) WORKSHEET.
//TOOLS OF RELIABILITY ANALYSIS -- Introduction and FMEAs
//nasa fmea bibliography
//Philips FMEA English
//An Introduction to Risk/Hazard Analysis for Medical Devices
//Using Failure Mode Effect Analysis (FMEA) to Improve Service Quality Service Operations Management
//QUANTIFIED RISK ASSESSMENT TECHNIQUES (PART 1)
//SURFACE VEHICLE RECOMMENDED PRACTICE
//Scenario-based FMEA
//PROCESS HAZARD ANALYSIS
//software fmea
//FMEA(umich)
//FMEA(sverdrup)
//using_failure_mode_and_effects_analysis_in_healthcare
//Procedures for Assessing Risks
//Incorporating a user-focused failure modes
//DACTRON控制器簡介
//包裝落下試驗機簡介
//衝擊試驗機簡介
//電磁式高頻振動試驗機
//環(huán)境應力篩選隨機振動簡介
//實驗室英文簡報資料
//實驗室中文簡報資料
//運輸型低頻振動試驗機
//運輸型低頻振動試驗機
//Ntuw_C防爆加熱干燥烘箱
//Hot Air Steriliser_C熱空氣消毒烘箱
//TU 60_C干燥加熱烘箱
//Vht_C真空干燥箱
//VTF_C潔凈加熱干燥烘箱
//Vtl_C加熱干燥烘箱
//英國華萊氏公司產(chǎn)品瀏覽
//BioLine V3.0_C_2003植物生長試驗箱
//Company Presentation V3.0_C_2003德國富奇介紹
//Human Performance Testing V3.0_C_2003人體資源測試
//IEC60068-3-5溫度變化率
//IP-Overview_C工業(yè)防護
//Pharma V3.0_C_2003制藥工業(yè)的藥品穩(wěn)定性試驗
//SC_C_2003陽光模擬試驗箱
//Thermalshock_C_2003溫度沖擊試驗箱
//V . T S C H - Climatic Test Cabinet 德國富奇公司-氣候試驗箱VC4018C
//VP_C_2003藥物穩(wěn)定性試驗
//Vsc_C_2003鹽霧試驗
//Vtsvcs_C_2003快速溫度變化試驗箱
//Vtvc_detail_C_2003高低溫試驗箱
//Vtvvcv_C_2003振動和更多的……
//WALK_IN_APP步入式試驗室
//Walkin_C_2003步入式模擬環(huán)境試驗室

CD2目錄
  RELIABILITY
//Application Notes for Solid Tantalum Capacitors
//Capacitor Lifetime Calculation 200302
//LIFETME CALCULATION FORMULA OF ALUMINUM ELECTROLYTIC CAPACITORS
//Guide to Use Aluminum Electrolytic Capacitors
//Aluminium Electrolytic Capacitors
//ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
//電解電容的應用
//電容壽命計算方法:
//電容衝擊試驗報告
//電容衝擊試驗報告
//壽命計算公式-max
//A11空調(diào)系統(tǒng)失效模式分析
//FMEA(sumida)
//FMEA
//FMEA手冊
//PFMEA案例
//系統(tǒng)FMEA
//Accelerated Thermal Cycling and Failure Mechanisms
//Accelerated_Standards_Transition_Plan_Approved_by_Board_06_04
//Accelerated stress testing
//the enviromental stress screen handbook
//Pre halt analysis
//談加速壽命試驗
//2003 CARTS Derating differences Ta-KO-AO
//sony ss-00259 handbook
//ADI Reliability Handbook
//stress test qualification for discrete semiconductors
//An Overview of Weibull Analysis
//balloons reliability analysis
//An Improved SPICE Capacitor Model
//CONSEQUENCES AND CATEGORIES OF SRAM FPGA
//COST ANALYSIS
//EEE PARTS DERATING
//Stochastic Aging and Dependence for Reliability
//Fault tree construction
//final drive and axle fluid requirements
//Fish Embryo Analysis
//FLOTHERM V4.1 Introductory
//Generalized Step Stress Accelerated Life Model
//HALT & HASS
//IBM ASIC Products Application Note
//IEC 60950
//Improving the Performance of Your Root Cause Analysis (RCA) Program
//The Application of Accelerated Testing Methods and Theory Accelerated Testing Methods and Theory HALT-HASS
//Life Testing and Reliability Predictions for Electromechanical Relays
//MAXIM reliability  report
//TESTING FOR RELIABILITY IN SPACE SYSTEMS
//MTBF Instruction Guide
//MTBF 計算方法概論
//MODELING AND SIMULATION OF RELIABILITY & MAINTAINABILITY PARAMETERS FOR REUSABLE LAUNCH VEHICLES USING DESIGN OF EXPERIMENTS
//on precendence life testing
//MEASUREMENT PRACTICES FOR RELIABILITY AND POWER QUALITY
//POST PROGRAMMING BURN IN (PPBI) FOR RT54SX-S AND A54SX-A ACTEL FPGAS
//Profile_PAL_draft_v1_3b
//MINI DIN Series Connector
Product Specification
(For Internal Use)

// USB Series Connector
  Product Specification
   (For Internal Use)
//THE RETAIL ELECTRIC COMPETITION TASK FORCE
//Reliability as a Systems Engineering Investment Not Just a Cost
//Reliability Design Technology for Power Semiconductor Modules
//Reliability Programs
//Reliability Engineering Principles
//Reliability Testing and Data Analysis of High-Density Packages’Lead-Free Solder Joints
//Dynamic reliability and risk assessment of the accident localization system of the Ignalina NPP RBMK-1500 reactor
//Semiconductor Device Reliability Failure Models
//Software Reliability Handbook Chaper11
//SONY SS-00259-1第四版(英日)
//SONY00254-5-R4
//Standard Linear IC reliability
//Stress test Qualification for Integrated Circuits
//System Availability Modelling
//The Challenge of Supporting Aging Naval Weapon Systems Aging Naval Weapon Systems
//Using Telcordia Calculation Methods to Adjust Failure Rates
//Warranty Cost An Introduction
//wetting balance theory
//包裝試驗方法
//產(chǎn)品的熱設計方法無圖
//電子產(chǎn)品可靠性設計及預計
//環(huán)境應力篩選(ESS)
//基于模糊優(yōu)化的零部件疲勞壽命可靠性分析
//結(jié)構(gòu)可靠性分析的區(qū)間方法
//可靠性基本計算
//可靠性預計方法及一點思考
//可信性工程
//零庫存系統(tǒng)
//潛在失效模式和效果分析
//潛在失效模式和效果分析2
//淺析2×xkW汽車電站雙機組對可靠性的影響
//塑膠產(chǎn)品外觀印刷品質(zhì)檢驗標準
//維護和可靠性
//系統(tǒng)可靠性理論與工程實踐
//以可靠性為中心的維護保養(yǎng)
//主板可靠性測試標準流程
//半導體集成電路的可靠性設計
//產(chǎn)品全壽命周期管理中的加速環(huán)境試驗技術(shù)
//當代質(zhì)量觀與可靠性
//電子元器件的可靠性安裝
//電子元器件的運輸、儲存和測量
//電子元器件的質(zhì)量與可靠性軍用標準體系
//電子專用設備的可靠性試驗
//電阻器與電位器的可靠性
//二十世紀留給二十一世紀可靠性工程熱點問題
//防止可靠性設計分析中的若干片面性
//非工作期微電路的可靠性及其預計
//高加速壽命試驗(HALT)與高加速應力篩選(HASS)
//功率模塊可靠性
//國外可靠性工程發(fā)展
//國外直升機可靠性 維修性和保障性發(fā)展綜述
//合理選擇繼電器提高家電可靠性
//基于環(huán)境的大型結(jié)構(gòu)物模態(tài)試驗
//幾種電子元器件長期儲存的失效模式和失效機理
//可靠度保證-工程與管理技術(shù)之應用
//可靠性工作主要內(nèi)容
//可靠性管理
//可靠性試驗的編碼故障樹分析
//可靠性預計和分配的作用原理及預期效益
//可靠性預計模型的參數(shù)敏感度分析
//可靠性增長試驗的體會
//美國可靠性分析中心(RAC)的可靠性培訓課程
//美國可靠性強化試驗技術(shù)發(fā)展點評
//某平顯可靠性鑒定試驗及思考
//失效率
//失效率曲線的分析與新修正模型的建立
//壽命數(shù)據(jù)分析理論參考英文版
//臺式電腦電子系統(tǒng)的驅(qū)動器可靠性評估
//微電路的質(zhì)量、可靠性等級
//微電路降額設計指南
//未來電子系統(tǒng)封裝可靠性面臨的困難
//一種威布爾壽命分布模型
//一種威布爾壽命分布模型
//元件可靠性




   EMC
//EMC電磁屏蔽材料設計者指南
//EMC文章集合(共50篇)
//如何盡量降低PCB板上的地噪聲
//防雷器在電源系統(tǒng)中的應用
//  運算放大器的選擇方法
//新一代數(shù)字IC
//電子設備、分系統(tǒng)和系統(tǒng)的電磁兼容
設計中的可靠性考慮
//射頻屏蔽室屏蔽效能的測試技術(shù)
//磁屏蔽理論和實踐
//局域網(wǎng)的電磁能量泄漏
//開關電源EMI濾波器的正確選擇與使用
//如何選擇屏蔽外殼
//ESD
//Electronic Design
//Electronic System Design
//EMC design technology
//High-Speed Board Design Techniques
//集膚效應
//Bus LVDS SER/DES FAQs
//ACPI Component Architecture Programmer Reference
//A critique of the EMC Directive
//Abatement of Static Electricity
//An EMC Directive for the Next Century
//COMPLIANCE SYSTEMS CORPORATION app_note_EN61000-4-5
//Australian EMC Regulation and Routes to Compliance
//Building a Bridge Between Product Safety and EMC
//Commercial Practices Standard Set to Replace MIL-STD 1686
//Developments in Electrical Safety Testing
//Electrical Safety Testing
//Electromagnetic Compatibility
//EMC & EMI of computer
//What to look for in an emc amplifiers
//EMC annata select
//What to look for in an emc antennas
//EMC base 基本概念
//EMC Chamber Calibration
//EMC Problems with Mobile Radio
//EMC Shielding
//信息技術(shù)設備的電磁兼容性標準
//EMC Standards and Their Application
//EMC standards of all
//EMC Standards
//EMC test and design The Impact of Emerging European Standards 、
//Trends in EMC Testing of household appliance
//智能型框架式斷路器單片機系統(tǒng)的電磁兼容性分析
//濾波器在抗EMI中的應用及發(fā)展
//Selecting the Right Fabric-Over-Foam EMI Gasket
//EMI Requirements in Japan
//Electromagnetic Interference (EMI) Damage to Giant Magnetoresistive (GMR) Recording Heads
//Evaluating the Nonmagnetic Shields
//Explosion Protection—The New Approach in Europe
//地線干擾與抑制
//超大規(guī)模集成電路中的可靠性技術(shù)應用與發(fā)展
//Medical EMC Standards
//Minimizing EMI from Heat Sinks
//Mitigating EMI in High-Speed Digital Transmission Networks
//Performing Safety Tests to Comply with the Low Voltage Directive
//Product Safety Standards
//Product Safety: Requirements and Methods
//Terminology for electromagnetic compatibility
//The FCC in Action to Address New EMC Concerns


    BATTERY
//Advanced Battery Engineering Facility
//An Analysis and Performance Evaluation of a Passive Filter Design Technique for Charge Pump PLL’s AN-1001
//Introduction to Power Supplies
//Don''t Throw Away Those Batteries!
//battery charging
//Keep Batteriies Alliive Through Better Battery Chargiing
//Demonstrates ACT battery chargers with enrev technology because “Help Can’t Wait”
//Cycling Information
//Efficiency and Power Utilization Data Guide DC DC Conversion Choices in Battery Operated Devices
//DC/DC變換器中的噪聲管理
//DESIGN & SAFETY CONSIDERATIONS
//down the idle power DS92LV16 Design Guide
//National Semiconductor DS92LV16 Design Guide
//A USER GUIDE TO COMPENSATING LOW-DROPOUT REGULATORS
//SWITCHING REGULATORS
//Buck-converter Charger also Provides System Power
//Frequently Asked Questions About Regulators
//Batteries The Achilles Heel in Wireless Communications
//Radio Reliability Depends on Careful Planning and Better Battery Charging
//鋰離子電池知識匯萃
//如何選擇鋰離子充電管理IC
//功率因數(shù)校正在走向低端電源
//LVDS FAQs Page
//A Guiide to Battery Maiintenance
//Consider the Complete Battery Management Process
//Nickel-Metal Hydride Application Manual
//Public Safety Stays Charged with Battery Equipment
//SYS Dept/BIOS Training_1025
//Power Management - Battery Monitoring
//Power Management - Battery Power Supply
//Power Management for Network Devices
//Emergency Preparedness Gets ACTivated
//Product Family Introduction Page
//A Priimer on Battery Chargiing
//CHARACTERISTICS OF RECHARGEABLE BATTERIES
//RZA Technology
//Smart Battery Data Accuracy Testing Guidelines
//Lower Operating Voltages Force Higher Efficiency Conversion in Battery Operated Appliances
//Targeting the Audiences for New PC Designs
//Temperature Effects
//The Many Flavors of LVDS
//thermal sensor of PC
//Ventation

   BIOS
//BIOS development
//bios function
//bios ring
//bios setup


CD3
Enviroment
//How reverb chambers work
//Chamber Temperature Uncertainty Analysis of the Thunder Scientific Model 2500 Two-Pressure Humidity Generator
//Uncertainty_Analysis Thunder Scientific
//SERIES 2500 BENCHTOP TWO-PRESSURE HUMIDITY GENERATOR
//About Temperature
//Chamber Study
//Circut enviroment test
//Customers Seeking Environmental Testing
//Enviroment test condition
//environmental
//HASS, HALT and ESS for electronics production
//humidity  temperature
//TEMPERATURE & HUMIDITY
AND
FAILURE ANALYSIS
BY
RE ENVIRONMENT TEAM

//Relative Humidity....Relative to What?
//Introduction of temperature measure
//Introduction of Thermal
GGT/RE – Environment Test Team
//USING THERMAL SHOCK
//非密封性分系統(tǒng)熱循環(huán)試驗中的防結(jié)露問題
//環(huán)境應力篩選有關問題的探討
//加速試驗
//熱力學
//溫度試驗中斷處理的依據(jù)


  ESS
//2002年度《RAMS》論文目錄
//國外CALS近期發(fā)展動態(tài)綜述
//國外CALS近期發(fā)展的三個新特點
//CSP封裝產(chǎn)品在熱應力循環(huán)條件下的可靠性分析
//環(huán)境應力篩選(ESS)
//ESS
//ESS_Fixture
//《通信設備可靠性通用試驗方法》YD/T 282-2000行業(yè)標準介紹
//GJB150_19
//HALT& HASS
//國際電工委員會IEC/TC56(可信性技術(shù)委員會)頒發(fā)的“可信性”國際標準
//Improper_ESS
//Improper_ESS_part_2
//MANAGING QUALITY
//Managing Reliability and Maintainability (R&M)
//quality and reliability
//reliability develop
//reliability training
//以可靠性為中心的維修發(fā)展動態(tài)
//SAE RCM標準的制訂背景
//Software Support Life Cycle Process Evaluation Guide
//測試污染對測試結(jié)果的影響
//測試技術(shù)要滿足工程項目需求
//Audit Report AA 00-341 High Level Architecture
//Audit Report AA 01-128 Integrated System Control
//Audit Report AA 01-23 Simulation High Level Architecture
//Managing Reliability and Maintainability
//Guidance on in-Service Reliability and Maintainability (R&M)
//Intraoperability and Interoperability of Marine Corps Tactical C4I Systems
//AF Instruction 33-133 Joint Technical Architecture -- Air Force
//Promulgation of DOD Policy For Assessment, Test, and Evaluation of Information Technology System Interoperability
//Compatibility, Interoperability, and Integration of Command, Control, Communications, and Computer (C4) Systems
//Design Interface
//Life Cycle Logistics Support and Materiel Fielding Process Technical Manual
//Life Cycle Logistics Support and Materiel Fielding Process Technical Manual2
//概率-物理方法——可靠性研究的新技術(shù)
//環(huán)境應力篩選有關問題的探討

  FMEA
//01_fmea_example
//failure analysis of semiconductor devices
//FMEA1
//FMEA Analysis Guidelines
//潛在失效模式及后果分析
//TOOLS OF RELIABILITY ANALYSIS -- Introduction and FMEAs
//FMEA2
//FMEA3
//FMEA失效模式和效果分析
//how to selling_root_cause to management
//Philips FMEA
//Potential Failure Mode and Effects Analysis
//Random-Failure-Models
/ROOT CAUSE ANALYSIS
//root causea nalysis chapter1
//SURFACE VEHICLE RECOMMENDED PRACTICE
//WHAT MAKES A ROOT CAUSE FAILURE ANALYSIS PROGRAM SUCCESSFUL
//故障模式影響分析
//如何進行失效模式與影響分析



  ESD
//Digital Phosphor Oscilloscopes
//A Safety Standard for Electrosensitive Protective Equipment
//Adding Value through Accredited Testing
//Littelfuse Cable Protectors for High Current Applications
//CMOS集成電路的ESD設計技術(shù)
//computer ESD solution
//Fundamentals of Electrostatic Discharge An Introduction to ESD
//ESD Suppression Technologies
//ESD Suppression Technologies ec622a ec622a
//Selecting an ESD Suppressor
//ESD Protection Audio Input and Output Lines
//Capacitance and Signal Integrity
//ESD Protection Digital Visual Interface Data Lines
//ESD Protection IEEE 1394 Data Lines
//ESD Protection USB 1.1 Data Lines
//ESD Protection USB 2.0 Data Lines
//ESD Protection Video Input and Output Lines
//General Purpose ESD Protection
//ESD Journal - The ESD & Electrostatics Magazine
//ESD protect
//ESD Standards
//Evaluation of Materials for Cleanliness and ESD Protective Properties
//Electrostatic Discharge (ESD) in Magnetic Recording Past, Present and Future
//Explosions and ESD
//From Electrostatics to ESD
//Fuse fact
//Ground planes for low cost boards
//Grounding Strategies for Printed Circuit Boards
//How Is Static Electricity Generated
//Is Static Electricity Static
//Littelfuse Resistors for Voltage Suppression
//SiVa ESD Demo
//The Competitive Advantage of Standards
//The Evolution of Guide into ISO 17025
//What It Means to ESD

  HALT
//ENVIRONMENTAL EFFECTS
//筆記本電腦失效模式分析表
//測試前筆記本性能測試
//測試前后的機構(gòu)電性功能驗證
//常見失效模式一覽表
//可靠性驗證測試
//失效分析是指研究產(chǎn)品潛在的或顯在的失效機理
//失效效應危害度一覽表
//ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
//A fundamental overview of accelerated-testing analytic models
//A5 P-FMEA
//accelerated and classical reliability methods integrated
//accelerated model
//accelerated test reference1
//accelerated test reference2
//accelerated test reference3
//accelerated test reference4
//美國可靠性強化試驗技術(shù)發(fā)展點評
//An approach to designing accelerated life-testing experiments
//Ast
//BCC-4V Halt Test
//Critical Analysis Team Report on Accelerated Waste Retrieval Final Design and Fixed Price Contracting
//Don’t Let the Cost of HALT Stop You
//電子設備的可靠性設計技術(shù)
//FEMMA Technology Overview FEMMA Technology Overview
/fixturing China presentation 2-04
//FMEA5
//HALT & HASS1
//HALT GUIDELINE 2004
//HALT Guideline
//HALT HASS SEMINAR PRESENTED BY ENVIROTRONICS
//The Application of HALT for Increased Product Reliability
//加速試驗綜述
//HALT&HASS基礎篇 - 中文 - 2003
//HALT-HASS
//HALT-Testing With a Different Purpose
//Hass and Halt
//HASS of Products With Very Low Failure Rates
//high reliability challenge of broadband equipment
//Highly Accelerated Life Testing
//緊湊型節(jié)能燈壽命的常規(guī)試驗方法
//Material failure mechanisms and damage models
//MTBF Assurance test
//PCB relia design
//Quick guide Accelerated Life Testing Data Analysis Basics
//quick guide life data analysis
//可靠性設計
//Reliability Glossary
//reliability prediction VS HALT testing
//Searching for appropriate humidity accelerated migration reliability tests methods
//System reliability modeling considering the dependence of component environmental influences
//understanding accelerated life testing analysis
//what is HAST testing
//why HALT cannot produce a meaningful MTBF number and why this should not be concern
//高加速壽命試驗(HALT)與高加速應力篩選(HASS)
//失效率
//用高壓鍋做測試

//統(tǒng)計知識
//概率與統(tǒng)計入門
研究.
//Pipe Wall Thickness Decisions Using Weibull Analysis
//Weibull analysis for production data
//Weibull Analysis of Production Data
//方差分析(1)
//方差分析(2)
//概率統(tǒng)計
//高級基本統(tǒng)計
//質(zhì)量管理中的技術(shù)統(tǒng)計

pcb
//BGA技術(shù)與質(zhì)量控制
//Creep of Pb of Pb-free Solders free Solders
//intel glossary
//High Speed Board Design
//LEAD-FREE MANDATE PLUMBS NEW DESIGN CHALLENGES
//印制電路板設計原則和抗干擾措施
//PCB化學鍍鎳金工藝介紹
//SMT technology
//電子工業(yè)的絲網(wǎng)印刷
//電子裝聯(lián)焊接技術(shù)現(xiàn)狀與課題
//混合信號電路板的設計準則
//局部焊接的應用
//無鉛焊料的開發(fā)與應用
//新手上路認識PCB
//印制電路板的可靠性設計措施
//印制電路工藝創(chuàng)新探討

CD4

//ATMEL可靠性報告
/MICROCHIP的可靠性報告
//Software Fault Tolerance
//高加速壽命試驗(HALT)與高加速應力篩選(HASS)
//論加速試驗
//HDBK-HALT-HASS
//LeCroy數(shù)字示波器操作手冊
//MTBF
//thermal module design
//散熱設計準則
//Vedio & Sound Technology
//振動測試概論
//Vibration Technology
//振動技術(shù)簡介
//An Overview of Vehicle Pass-by Noise
//Time Domain Acoustical Holography and Its Applications
//Key Steps and Methods in the Development of Low Noise Engines
//Squeak and Rattle –State of the Art and Beyond
//Changing the Effective Mass to Control Resonance Problems
//Torsional Resonance Analysis in Air Handling Units
//Understanding the Physics of Electrodynamic Shaker Performance
//An Overview of Vehicle Pass-by Noise
//Newtonian Physics
//Conservation Laws
//Electricity and Magnetism
//Building Vibration Can Contaminate Clean Factories, Cleanrooms And Clean Activitie
//cots vibration testing
//Do We Know What We Are Doing
//Drop Tests vs Shock Table Transportation Tests
//Dynamic design
//Experimental Modal Analysis
//LASER ALIGNMENT SPECIFICATION FOR NEW AND REBUILT MACHINERY, EQUIPMENT AND COMPONENTS
//GENERAL MOTORS CORPORATION VIBRATION STANDARD
//Going To Witness A Vibration Test
//Going To Witness A Vibration Test
//Guidelines for Jury Evaluations of Automotive Sounds
//King Design Test Specification 1.2
//Mechanical Waves
//Newtonian Physics
//FedEx Package_Testing_Procedures
//PSD pattern 及 total Grms 值的計算
//Refraction of Sound Waves
//Rotational_Shock
//shock test system
//Squeak and Rattle –State of the Art and Beyond
//The Dynamic Vibration Absorber
//The Politics of Accelerated stress testing
//Time Domain Acoustical Holography and Its Applications
//Torsional Resonance Analysis in Air Handling Units
//Understanding the Physics of Electrodynamic Shaker Performance
//vibration test detail
//Vibration
//Vibrations and Wave
//包裝設計基礎
//包裝試驗
//多軸振動環(huán)境試驗技術(shù)
//海軍制造篩選程序
//可靠性振動基礎
//中高量級沖擊試驗技術(shù)
//weibull的有關問題(共30份)
//BGA可靠性表征項目:溫度循環(huán)試驗
/ESD損傷實例
//半導體分立器件的可靠性設計
//半導體集成電路的可靠性設計
//半導體器件失效原因分析
//當代質(zhì)量觀與可靠性
//電氣繼電器(第20部分保護系統(tǒng))
//電容器的可靠性設計
//電子元器件的防靜電應用
//電子元器件的防浪涌應用
//電子元器件的防噪聲應用
//電子元器件的抗輻射應用
//電子元器件的可靠性安裝
//電子元器件的選擇和應用
//電子元器件的質(zhì)量與可靠性軍用標準體系
//電子元器件電路布局的可靠性設計
//電子元器件控制
//電阻器的使用問題
//電阻器與電位器的可靠性
//方案階段
//非氣密性激光模塊的高加速壽命試驗
//概述
//硅可控整流器(SCR)的使用問題
//化學物理電源的可靠性設計
//環(huán)境加速試驗的條件
//基本概念二
//基本概念三
//基本概念四
//基本概念五
//基本概念一
//計算機輔助可靠性評價技術(shù)
//可靠性工程技術(shù)現(xiàn)狀2001年報告
//可靠性工作主要內(nèi)容
//可靠性技術(shù)講座(下)
//可靠性篩選
//微電路的型號命名和采購
//微電路的選用原則
//微電路的質(zhì)量、可靠性等級
//微電路降額設計指南
//預防ESD損傷的措施
//元器件優(yōu)選目錄編制要求
//35 MAINTENANCE AUDITS
//FAILURES AND ERRORS
//A Metric for Focusing Reliability Efforts
//AN OVERVIEW OF WEIBULL Chpt1
//ASTM_testing
//Availability and Reliability
//Ball-Bearing-Data-by-Lieblein-and-Zelan
//basic of oil analysis
//business centered maintenance
//Project Management Professional Certification Handbook 03-2002
//Changing_your_organization_for_better1
//Changing_your_organization_for_better2
//Changing_your_organization_for_better3
//Changing_your_organization_for_better4
//Changing_your_organization_for_better5
//Cost Of Unreliability
//Cost_Effective_Calibration
//定義必要的可靠性
//Distribution & Logistics Strategy
//Establishing a sense of urgency
//執(zhí)行測試
//Heat Exchanger IRIS Wall Thickness And Gumbel Smallest Distribution
//How To Justify Equipment Improvements Using
//Integrated Service Technology
//Key_Performance_Indicators
//manufacturing and business excellence
//maximizing_maintenance_profits
//micro reliability and lifetime estimation
//Moving from a Repair focused to a Reliability focused Culture
//Moving from a Repair-focused to a Reliability-focused Culture
//MTBF for notebook
//notebook test Plan
//OCE
//Predict Future Failures From Your Maintenance Records
//REDUCING THE COST OF PREVENTIVE MAINTENANCE
//reliability glossary
//Reliability STD
//Reliabilty and dependability standards are described
//ROHS E文版
//ROHS中文版
//Comparison of Reliability-Availability Mission Simulators
//Small Sample Size Datasets Help or Hindrance
//Solder Data Practice Guide
//SONY STANDARD SS-00259 中英文版
//VIII. STANDARDS AND QUALITY CERTIFICATION FOR QUALITY SYSTEMS,SAFETY, ANDRELIABILITY OF SEMICONDUCTOR DEVICES
//statistical investigation of fatigue life of deep-groove ball bearings
//UK Defence Standardization
//WEEE中文版
//電子產(chǎn)品制造防靜電測試規(guī)范
//美國可靠性工程試題集
//威布爾分布壽命分析
//芯片驗證測試及失效分析

CD5
MIL-HDBK-17 1F,2F,3F,4F,5F
MIL-STD-883 E,Notice1,2,3,4,5
MIL-STD-461 E,CROSSREFRENCE
MIL-STD-750D Notice1,2,3,4,5
MIL-STD-1246 C,1,2,3,4,5
MIL-HDBK-5 (H,NOTICE)
MIL-STD-810

Number Revision Date Title
MIL-B-5085 B 10/64 Bonding for Aerospace Systems
MIL-HDBK-5H - 12/98 Metallic Materials and Elements(The original issue is 20 MB; Notice 1 is 42MB
Notice 1 10/02
MIL-HDBK-17 Composite Materials Handbook
        Volume 1 F 06/02 Polymer Matrix/Guidelines for Characterization
        Volume 2 F 06/02 Polymer Matrix/Materials Propoerties
        Volume 3 F 06/02 Polymer Matrix/Materials Usage, Design and Analysis
        Volume 4 F 06/02 Metal Matrix Composites
        Volume 5 - 06/02 Ceramic Matrix Composites
MIL-HDBK-340 Notice 1 10/94 Application Guidelines for MIL-STD-1540
MIL-HDBK-343 - 02/86 Design, Construction, and Test Requirements forOne-of-a-Kind Spacecraft
MIL-M-38510 J 11/91 Military Specification, Microcircuits
MIL-PRF-13830 B 01/97 Optical Component Inspection
MIL-PRF-19500 M 10/99 Performance Specification, Semiconductor Devices
QML-19500 22 05/04            Qualified Manufacturers List
MIL-PRF-31032 - 11/95 Printed Circuit Board, General Spec.
MIL-PRF-38534 E 01/03 Performance Specification, Hybrid Circuits
QML-38534 48 03/04             Qualified Manufacturers List
MIL-PRF-38535 F 12/02 Performance Specification, Integrated Circuits
QML-38535 17 07/03             Qualified Manufacturers List
MIL-STD-202 G 02/02 Test Method Standad, Electronic Parts
MIL-STD-461 E 08/99 Control of Electromagnetic Interference
        Draft = 06/99 461 Draft in MSWord Format
        Cross Reference = 03/01 Comparison of 461E with other standards
MIL-STD-750 D 02/95 Test Method, Semiconductor Devices
Notice 1 05/95
Notice 2 02/96
Notice 3 02/00
Notice 4 04/01
Notice 5 11/02
MIL-STD-810 F 08/02 Test Method Standard/Env. Eng. Tests
MIL-STD-883 E 12/96 Test Method Standard/Microcircuits
Notice 1 12/97
Notice 2 08/98
Notice 3 11/99
Notice 4 12/00
Notice 5 03/03
MIL-STD-1246 C 04/94 Cleanliness Levels
Notice 1 05/94
Notice 2 12/94
Notice 3 06/98
Notice 4 02/02
MIL-STD-1540 E-Draft 12/02 Test Requirements for Launch & Space Vehicles(restricted access)
MIL-STD-1553 B 09/76 Multiplex Data Bus
Notice 1 02/80
Notice 2 09/86
Notice 3 01/93
Notice 4 01/96

CD6
REPORT # TITLE DATE NOTES
MIL-HDBK-1512 ELECTROEXPLOSIVE SUBSYSTEMS, ELECTRICALLY INITIATED, DESIGN REQUIREMENTS AND TEST METHODS 9/30/1997
MIL-HDBK-1857 GROUNDING, BONDING AND SHIELDING DESIGN PRACTICES 3/27/1998
MIL-HDBK-235-1B ELECTROMAGNETIC (RADIATED) ENVIRONMENT CONSIDERATIONS FOR DESIGN AND PROCUREMENT OF ELECTRICAL AND ELECTRONIC EQUIPMENT, SUBSYSTEMS AND SYSTEMS 5/1/1993
MIL-HDBK-235-1B(1) ELECTROMAGNETIC (RADIATED) ENVIRONMENT CONSIDERATIONS FOR DESIGN AND PROCUREMENT OF ELECTRICAL AND ELECTRONIC EQUIPMENT, SUBSYSTEMS AND SYSTEMS 12/22/2000 Notice of Validation
MIL-HDBK-237C ELECTROMAGNETIC ENVIRONMENTAL EFFECTS AND SPECTRUM CERTIFICATION GUIDANCE FOR THE ACQUISITION PROCESS 7/17/2001
MIL-HDBK-240 HAZARDS OF ELECTROMAGNETIC RADIATION TO ORDNANCE (HERO) TEST GUIDE 11/1/2002
MIL-HDBK-263B ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES, AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) (METRIC) 7/31/1994
MIL-HDBK-274 ELECTRICAL GROUNDING FOR AIRCRAFT SAFETY 11/1/1983
MIL-HDBK-274(1) ELECTRICAL GROUNDING FOR AIRCRAFT SAFETY 6/29/1990 Change Notice 1
MIL-HDBK-293 ELECTRONIC COUNTER-COUNTERMEASURES CONSIDERATIONS IN RADAR SYSTEMS ACQUISITION 6/5/1987
MIL-HDBK-294 ELECTRONIC COUNTER-COUNTERMEASURES CONSIDERATIONS IN NAVAL COMMUNICATION SYSTEMS 12/31/1986
MIL-HDBK-335 MANAGEMENT AND DESIGN GUIDANCE ELECTROMAGNETIC RADIATION HARDNESS FOR AIR LAUNCHED ORDNANCE SYSTEMS 1/15/1981
MIL-HDBK-335(2) MANAGEMENT AND DESIGN GUIDANCE ELECTROMAGNETIC RADIATION HARDNESS FOR AIR LAUNCHED ORDNANCE SYSTEMS 12/28/1992 Notice of Validation
MIL-HDBK-419A GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES 12/29/1987
MIL-HDBK-454A GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT 11/3/2000

REPORT # TITLE DATE
DI-EMCS-80199B Electromagnetic Interference Control Procedures (EMICP) 8/20/1990
DI-EMCS-80200B Electromagnetic Interference Test Report (EMITR) 8/20/1990
DI-EMCS-80201B Electromagnetic Interference Test Procedures (EMITP) 8/20/1990
DI-EMCS-81295 Electromagnetic Verification Procedures (EMEVP) 11/25/1992
DI-EMCS-81528 Electromagnetic Compatibility Program Procedures 11/14/1996
DI-EMCS-81540 Electromagnetic Environmental Effects (E3) Integration and Analysis Report (E3IAR) 12/19/2002
DI-EMCS-81541A Electromagnetic Environmental Effects (E3) Verification Procedures (E3VP) 12/19/2002
DI-EMCS-81542A Electromagnetic Environmental Effects (E3) Verification Report (E3VR) 12/19/2002
DI-MISC-81113 Radar Spectrum Management (RSM) Test Plan 12/8/1990
DI-MISC-81114 Radar Spectrum Management (RSM) Control Plan 12/5/1990
DI-RELI-80669A Electrostatic Discharge (ESD) Control Program 8/28/1992
DI-RELI-80670A Reporting Results of Electrostatic Discharge (ESD) Sensitivity Tests of Electrical and Electronic Parts Assemblies and Equipment 8/28/1992
DI-RELI-80671A Handling Procedures for Electrostatic Discharge (ESD) Sensitive 8/28/1992

igetit@etang.com
如蒙饋贈,感激不盡!

<電磁兼容設計工程手冊>
<開關電源的電磁兼容設計>
<開關電源的尖峰干擾及其抑制>
<開關電源的抗干擾問題>
<開關電源EMI濾波器的正確選擇與使用>

<概率-物理方法——可靠性研究的新技術(shù)>
<質(zhì)量管理中的技術(shù)統(tǒng)計>
<概率與統(tǒng)計入門>

你要的資料的文件太大拉

1131090470.pdf
Critical Analysis Team Report on Accelerated Waste Retrieval Final Design and Fixed Price Contracting

1131090646.doc
Don’t Let the Cost of HALT Stop You

1131186929.doc
印制電路板的可靠性設計措施

1131186970.doc
新手上路認識PCB

好人啊!我看你哪兒的資料不少啊.呵呵都想要.你那刻光盤嗎??

哥們,生意不錯嘛!
我朋友是刻光盤的,我們合伙吧,你把資料給我,然后我刻,就可以拿出去賣了啊!  你7我3

真的啊!
兄弟,好貴的哦!

多少錢一張啊?

1131324500.pdf
Electronic Aspects

1131324687.pdf
fabricating color TFT LCD

1131361060.doc
Flat Panel Display Technology

1131454870.doc
加速試驗

1131454952.pdf
environmental

1131540476.htm
Adding Value through Accredited Testing

1131589078.pdf
Audit Report AA 01-128 Integrated System Control

1131627547.pdf
CreepofPb-freeSolders

1131627760.pdf
PCB basic

1131712186.doc
混合信號電路板的設計準則

1131791165.doc
失效效應危害度一覽表

1131791243.doc
失效分析是指研究產(chǎn)品潛在的或顯在的失效機理

1131964834.pdf
SiVa ESD Demo

1131964922.pdf
Selecting an ESD Suppressor

1132054306.pdf
What It Means to ESD

1132054554.pdf
Evaluation of Materials for Cleanliness and ESD Protective Properties