The TPS6103x devices provide a power supply solution for products powered by either a one-cell Li-Ion or Li-polymer, or a two to three-cell alkaline, NiCd or NiMH battery. The converter generates a stable output voltage that is either adjusted by an external resistor divider or fixed internally on the chip. It provides high efficient power conversion and is capable of delivering output currents up to 1 A at 5 V at a supply voltage down to 1.8 V. The implemented boost converter is based on a fixed frequency, pulse-width- modulation (PWM) controller using a synchronous rectifier to obtain maximum efficiency. At low load currents the converter enters Power Save mode to maintain a high efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixed switching frequency. It can also operate synchronized to an external clock signal that is applied to the SYNC pin. The maximum peak current in the boost switch is limited to a value of 4500 mA.The converter can be disabled to minimize battery drain. During shutdown, the load is completely disconnected from the battery. A low-EMI mode is implemented to reduce ringing and, in effect, lower radiated electromagnetic energy when the converter enters the discontinuous conduction mode.The device is packaged in a 16-pin QFN package measuring 4 mm x 4 mm (RSA) or in a 16-pin TSSOP PowerPAD package (PWP).

建議先看看資料

http://www.ti.com.cn/product/cn/tps61030

PowerPAD接GND一定要大面積鋪銅，來(lái)加大散熱。

首先要確實(shí)是一上電就壞了么？如果是一上電就壞，那么可能是你電路的設(shè)計(jì)問(wèn)題，

如果是工作了很長(zhǎng)時(shí)候壞的，看一下是不是芯片太熱了？

VBAT管腳對(duì)地短路說(shuō)明IC壞了，測(cè)試下負(fù)載的電流，是不是負(fù)載太大燒了？貼出電路原理圖吧，或許其它設(shè)計(jì)上的問(wèn)題。。。

做一下芯片的溫升測(cè)試。

一般而言，powerpad都是接地并且開窗散熱。首先得檢查你的電路，以及pcb設(shè)計(jì)，看看是不是硬件的問(wèn)題。芯片八成是燒了。

首先檢查硬件電路是否有問(wèn)題，排除這個(gè)沒(méi)問(wèn)題之后，通電一會(huì)燒掉？一會(huì)不知道是多久，應(yīng)測(cè)量下IC溫度，是否是溫度過(guò)高燒掉了？

從你，描述的現(xiàn)象上來(lái)看，這個(gè)芯片熱損壞的可能性是非常大的，接地的焊盤一定要加錫進(jìn)行散熱才行的！

大面積鋪銅試試看，我一般的地都是鋪銅的，這樣散熱好一些。如果鋪銅還不行就只能再看看其他地方了。

實(shí)測(cè)下芯片的溫度看是否超標(biāo)了，是不是溫度過(guò)高把芯片搞壞了。。

芯片不會(huì)無(wú)緣無(wú)故出問(wèn)題的，如果是按照官方設(shè)計(jì)的話，可能就是你的散熱沒(méi)有處理好。

如果空載就燒的話應(yīng)該不是溫度問(wèn)題，如果空載沒(méi)問(wèn)題帶載燒的話應(yīng)該就是散熱問(wèn)題了。這種芯片只能靠肚皮底下到銅基板通過(guò)PCB散熱，不焊上很可能過(guò)熱燒掉。另外此芯片屬于低功耗芯片，非常怕靜電，焊接時(shí)要注意一下。